Post exposure bake (PEB) heater

Wed, 24 Jun 2026 01:24:08 +0800

On the lithography floor, a PEB heater that drifts even 0.2°C can eat your CD margins and quietly drive yield loss. We built this post-exposure bake heater to take that variability out of the equation, so your photoresist chemistry behaves the way the recipe expects. What matters under the hood We’re targeting ±0.1°C wafer-level thermal uniformity across the bake surface, so soft bake and hard bake are repeatable, lot after lot. Short-wave infrared elements give you fast, clean ramp-ups and response times that keep thermal budget tight and cycle time predictable. The hot zone is engineered to generate zero particles, so it sits comfortably in cleanroom Class 1–100 without adding contamination risk. Power, voltage, and footprint match standard tool envelopes, and the interface is laid out for straightforward integration into what you already have. Why this matters in production In high-volume fabs, PEB temperature stability is what actually controls critical dimension behavior and line-edge roughness. With ±0.1°C uniformity, you cut within-lot and across-lot excursions, keep the process centered, and reduce scrap. Energy use is optimized because the system hits setpoint quickly and holds it steadily—less idle heat, fewer unnecessary recalibrations. The design is validated for 24/7 operation, with service intervals that are long and predictable. In other words, you get uptime, not emergency downtime. Things to verify before you swap it in This heater is engineered as a direct, validated equivalent to international semiconductor equipment standards, but final compatibility still comes down to your tool’s interface. Check mounting, connector types, and any chamber-specific shielding before installation. Plan a short thermal profile re-verification run after the swap—usually less than a shift to lock in the new bake curve and confirm CD stability.

Post on Warm IR Heating Equipment

Post exposure bake (PEB) heater